AutoForm-Incrementalplus

Software for Rapid and Accurate Simulation and Validation of the Complete Stamping Process

AutoForm-Incrementalplus incorporates highly advanced technology to address the challenges of today’s quickly changing and increasingly competitive market place. It demands a variety of innovative and high quality stamping products while at the same time, cost reduction and ever shorter delivery times are imperative.

AutoForm-Incrementalplus is specialized for the rapid and accurate simulation and validation of the complete stamping process. All of the Top 20 automotive OEMs and most of their suppliers have selected AutoForm-Incrementalplus as their software of choice.

AutoForm-Incrementalplus rapidly and accurately simulates and validates all operations in the sheet metal stamping process: drawing, restriking, trimming, flanging, springback and hemming. The latest technological achievements combined in AutoForm-Incrementalplus enable users to address complex issues that arise in practice and to achieve a new level of competitiveness.

AutoForm-Incrementalplus brings innovative features and benefits:

  • Precise tryout simulation of deep drawing, restriking, trimming, flanging and hemming operations
  • Comprehensive results including formability, surface quality and springback
  • Final validation of tool and process design before tool manufacturing
  • Rapid verification of multiple new concepts for quality and cost improvements
  • Most accurate tryout results with fastest turnaround time

The state-of-the-art technology which is used across a broad spectrum of applications has made AutoForm-Incrementalplus the most highly recognized and widely used software in the automotive industry.

Fields of Applications:

This product may practice one or more of the following patents owned by or available to AutoForm Engineering GmbH, Switzerland: European patents 1290515, 1623287, 1665103, 1741012, US patents 7542889, 7623939, 7870792, 7885722, 7894929 and JP patents 4633625, 4852420. Other European, other US and other JP patents pending.

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